Global OSAT Carsem operates as a leading turnkey packaging and test services provider with a large portfolio, multiple high-tech factories, and certifications (IATF 16949, ISO standards) that enable broad semiconductor packaging and testing capabilities to potential customers.

High Throughput With over 5,000 employees and weekly assembly volumes exceeding 100 million units, Carsem demonstrates scale and capacity for high-volume IC packaging and test services, appealing to customers seeking robust manufacturing partner capabilities.

Quality & Compliance Extensive quality and sustainability certifications plus adherence to the Sony Green Partner Program indicate a strong quality, environment, and social standards framework that can reassure prospects seeking reliable and compliant manufacturing partners.

MIS Packaging R&D Active development of MIS substrate technology for IC packages positions Carsem at the forefront of advanced packaging trends, presenting opportunities to win customers in analog, power, and emerging crypto-related markets.

Recognition & Growth Recent safety awards and affiliation with the Hong Leong Group signal stability, reliability, and potential for expanded regional collaboration, aiding outreach to strategic accounts seeking proven suppliers with strong corporate backing.