Industry Leadership FlipChip International’s leadership in wafer-level chip scale packaging and its extensive patent portfolio position it as an innovative player in high-volume advanced packaging, making it a promising partner for clients seeking cutting-edge semiconductor assembly solutions.

Diverse Market Reach Serving the consumer, automotive, aerospace, and medical sectors, FCI offers opportunities to collaborate with companies across multiple high-growth industries, particularly those emphasizing miniaturization and advanced packaging technologies.

Global Manufacturing With certified manufacturing facilities in the U.S. and China supporting high-volume production, FCI can meet the geographic and scaling needs of international clients looking for reliable and high-quality semiconductor assembly services.

Technological Edge FCI’s use of advanced technologies such as Cu Pillar Bumping and Spheron WLCSP presents opportunities to provide value-added, innovative packaging solutions to semiconductor firms aiming to enhance device performance and integration.

Growth Potential With revenue estimates between 10 and 25 million dollars and a focus on tech-driven high-volume production, FCI is positioned for expansion, offering potential sales prospects with semiconductor companies seeking to outsource or upgrade their assembly and testing capabilities.