Hesse GmbH
Machinery ManufacturingNorth Rhine-westphalia, Germany51-200 Employees
Since 1986 the Hesse GmbH was mainly working in the field of industrial automation. In 1995 the company started to build and sell high tech equipment for semiconductor industry. The headquarters are located in Paderborn, Germany. A worldwide customer base is served either directly from Germany or by subsidiaries in Hong Kong, USA or by a local network of sales & service partners in over 30 countries. The Hesse GmbH develops and delivers customer specific equipment for the back-end: heavy wire and thin wire wedge bonder, ultrasonic flipchip bonder and special systems right up to complete production lines. Core competence is the consistent customer orientation, high innovation power and the application of state of the art technology. We invest in all relevant technologies to achieve maximum technical abilities and with the interaction of mechanics, electrics/electronics and software we are able to generate optimum solutions. Examples are the development of a series of wear-free piezo bondheads in a simplistic construction: a development which gained world-wide recognition. Another example is the patented process integrated quality control which measures friction, frequency, current, voltage and deformation in real-time.
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