Emerging Nano Interconnect IIC offers a revolutionary Quilt Packaging technology that enables ultra-low loss interconnections and sub-micron chip-to-chip alignment, presenting a compelling value prop for customers seeking higher density, improved performance, and cost reductions through chip reconstitution.

Targeted Prototyping The company partners with customers to implement QP in existing processes and conducts proof-of-concept prototyping, creating a clear sales path from tech evaluation to viable pilots and license deals.

Flexible IP Integration QP enables mixing and matching IP cores and designs with potentially significant time-to-market and yield improvements, appealing to customers wanting modular, scalable system architectures.

Early-Stage Growth With revenue in the low single to mid single digits and recent funding, IIC is in an exploration phase where strategic collaborations, pilot licenses, and funded R&D partnerships could accelerate client onboarding and revenue scale.

Strategic Partnerships IIC’s collaboration model with university researchers and industry licensees positions it to pursue co-development, sponsored research, or joint go-to-market arrangements with semiconductor designers and OEMs seeking next-generation packaging solutions.