Invensas Corporation

Semiconductor ManufacturingCalifornia, United States11-50 Employees

Invensas Corporation develops and licenses advanced semiconductor packaging and 3D interconnect technologies that help electronics become smaller, faster, and more power-efficient while adding functionality. Its solutions are used in DRAM memories, image sensors, RF devices, MEMS sensors, processors, and other mixed-signal components produced in high volumes by leading original equipment manufacturers, original design manufacturers, and integrated device manufacturers. The company is a wholly owned subsidiary of Tessera Technologies, Inc., and is based in San Jose, California, with a relatively small workforce. 

Within the semiconductor manufacturing landscape, Invensas specializes in packaging and 3D interconnects that enable next-generation electronics. In September 2017, the company filed patent infringement lawsuits against Samsung Electronics and Samsung Austin Semiconductor in the U.S. District Court for the District of Delaware.

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