NANO3D Systems

Semiconductor ManufacturingBeaverton, United States2-10 Employees

Nano3D Systems provides electrochemical metallization solutions for high tech applications.  Use our proprietary high-resolution atypical photoresist or our electroless plating solutions for conformal plating of 3D features and electroplating solutions for rapid plating of fine features or to fill high-aspect-ratio blind vias or through-holes. 

Reduce costs by replacing vapor deposition with conformal electroless plating in nickel, cobalt, or copper; fill deep voids or build bumps and pads using high-speed electroplated copper.  Fight substrate-metal coefficient of thermal expansion (CTE) mismatch with tunable nickel-iron alloys, including ultra-low CTE Invar.  

Nano3D Systems' eLOCOS(TM) electrodeposition technology can also be applied to: selective metallization of microstructures, direct-writing of metals onto flexible materials, HDI fabrication, in-house prototyping of micron scale features, plating of nanoparticles and microparticles in regular or irregular shapes.

Nano3D Systems is an Oregon Nanoscience and Microtechnology Institute (ONAMI) portfolio company, with facilities in Corvallis, OR., and resources at nearby universities.  Nano3D Systems can assist in determining a plating process that will work for your project, from substrate prep to plating.  Solutions are readily tailored to your needs, even unusual materials such as indium, metal carbon-nanotube composites, and many other materials not readily available for purchase.

For small batch orders of some of our more popular solutions, visit our online store at www.nano3dsystems.com.  For larger quantities, specialty solutions, or R&D services, contact us through the website or at info@nano3dsystems.com

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