SET Corporation Email Format
Semiconductor ManufacturingAuvergne-Rhône-Alpes, France51-200 Employees
SET Corporation designs and manufactures equipment for high-precision semiconductor assembly, a lineage it has pursued since 1975. Its offerings include high-accuracy bonding systems and NanoImprint Lithography capabilities, delivering sub-micron post-bonding accuracy for diverse bonding tasks on substrates up to 300 mm. Based in Saint-jeoire, in the Auvergne-Rhône-Alpes region of France, SET serves laboratories and semiconductor companies that require reliable, precise component assembly. With Flip-Chip Bonders deployed worldwide, the company has a global footprint and emphasizes flexibility in bonding applications. In September 2019 SET announced the release of NEO HB, an automatic bonder designed for ±1 µm 3σ post-bonding accuracy in standalone or EFEM-enabled configurations.