SiP portfolio T2M specializes in silicon-proven IP cores across BLE, WiFi, NB-IoT, GNSS, USB, MIPI/CSI/DSI, and display interfaces, plus DVB and AI-oriented cores. This broad IP catalog presents multiple cross-sell opportunities for customers building IoT devices, wireless applications, and multimedia-enabled consumer electronics.

Die-to-Die Recently announced UCIe Die-to-Die Interface IP core enables scalable chiplet-based SoCs, supporting next-generation modular designs. This creates a compelling upsell path for customers pursuing advanced packaging, high-performance compute, or cost-effective integration in complex system architectures.

Industry Momentum Active participation in DAC, MWC Shanghai, and RISC-V Summit signals ongoing market engagement and visibility among leading semiconductor integrators. Leverage event traction to initiate conversations with design teams exploring IP acceleration for IoT, automotive, industrial, and asset-tracking applications.

Growth Signals Revenue scale is modest but indicates a focused niche with a global footprint and senior leadership access. Potential for rapid expansion through tier-1 customer collaborations, co-development programs, and platform licensing to accelerate adoption in emerging silicon markets.

Technical Breadth Deep IP offerings spanning wireless, video, display interfaces, AI-enabled cores, and security-related components position T2M as a one-stop vendor for SOC teams. This supports multi-domain sales plays targeting devices requiring integrated, production-ready IP for faster time-to-market.