Prototyping Partner TempGP Engineering delivers end to end hardware development, covering electronics design, PCB fabrication, firmware development, enclosure manufacturing, and mechanical and 3D work, enabling customers to move quickly from concept to functional prototypes with minimal vendor coordination.

Embedded Systems Strong embedded systems focus with support for PIC, AVR, ARM and DSP families, combined with in house firmware development and hardware integration, making TempGP a capable partner for projects requiring rapid iterations and thorough validation.

Onsite Prototyping In house machinery enables rapid prototyping on site, reducing cycle times and enabling fast concept validation for startups, R and D teams, universities, and design studios that need quick proofs of concept.

NYC Collaboration Located in Brooklyn near New York City's tech ecosystem, TempGP has opportunities to engage local startups, accelerators, universities, and design firms through proximity based collaborations and pilot projects.

Lean Flexibility With a lean team, TempGP can act as a flexible extension to client engineering groups, offering scalable contracted R&D capacity, design for manufacturability input, and long term product development partnerships to win larger programs.