One Stop OSAT Integrated capabilities enable turnkey OSAT solutions across packaging and test, including wafer bumping, probing, grinding, various packaging options, and RF, analog, digital, and mixed signal testing. Design, assembly, test, failure analysis, and thermal and electrical characterization are offered to support end to end reliability and fast time to market.

Auto MEMS Focus Unisem has experience in MEMS and automotive high volume production, supported by multiple factory sites in Malaysia and China. This creates a strong value proposition for MEMS sensor and automotive customers seeking regional manufacturing with scalable capacity and proven reliability.

Regional Footprint The multi site footprint enables regional delivery in APAC, reducing logistics complexity and enabling closer customer collaboration. This supports faster lead times, better supply chain resilience, and local engineering support for design for test and characterization.

Broad Packaging A wide portfolio including wafer level CSP and RF, analog, digital, and mixed signal tests provides flexibility to meet diverse customer needs and enables cross sell opportunities from existing clients to advanced packaging solutions.

Quality Partnership The combination of reliability focus, failure analysis, and modeling capabilities aligns with OEMs prioritizing quality and uptime. Unisem can position as a preferred OSAT partner for high yield, long term automotive, consumer electronics, and industrial applications.