Strategic expansion VIS’s new Singapore 12-inch FAB in collaboration with NXP and plans for a second Singapore fab signal a significant capacity expansion and regional diversification. This presents opportunities to position VIS for customers seeking geographically closer wafer supply, improved cycle times, and supply resilience in Asia-Pacific.

Capacity and growth With five 8-inch fabs in Taiwan and Singapore and a 2024 monthly capacity of about 282,000 wafers, VIS is scaling up to meet rising demand in high voltage, analog, MEMS, and embedded memory segments. Sales teams can target customers seeking scalable production with multiple technology options.

Technology breadth VIS offers a wide process portfolio including High Voltage, IsoSOI, BCD, Mixed-Signal, MEMS, and Embedded Memory, enabling tailored solutions for customers in automotive, IoT, AI peripheral, and memory-intensive applications. This breadth supports cross-sell into existing customers expanding product lines.

Financial momentum Recent quarterly revenue milestones and double-digit QoQ growth, driven by memory and logic shipments and price adjustments, indicate improving margins and demand. This strengthens VIS’s value proposition for customers seeking reliable, cost-competitive foundry services with capacity to scale.

Partnership potential The VIS-NXP joint venture and ongoing collaborations suggest strong ecosystem leverage. Sales opportunities exist to co-develop and co-sell advanced process technologies, capitalize on combined customer bases, and attract strategic customers seeking robust, globally backed manufacturing capabilities.