Insights

Innovative Product Expansion Winbond is actively developing advanced memory solutions including 8Gb DDR chips on a 16nm process, indicating a focus on cutting-edge technology that appeals to high-performance electronics manufacturers and data-intensive applications.

Growing Secure Memory Portfolio The launch of QspiNAND and secure products based on OpenTitan demonstrates Winbond's emphasis on secure and high-throughput memory solutions for IoT, wearable devices, and industrial markets, creating opportunities in security-focused hardware segments.

Targeting Emerging Markets Winbond’s recent emphasis on low-power and high-density Flash solutions positions it well to capture sales within the expanding IoT, wearable, and automotive sectors that demand reliable, energy-efficient memory products.

Global Presence and Partnerships With subsidiaries across major markets and collaborations with technology firms like zeroRISC, Winbond’s international footprint and strategic alliances enhance its potential to reach diverse enterprise and OEM customers.

Flexible Financial Positioning While revenue ranges between 100M and 250M, Winbond’s ongoing product innovation and expanding memory portfolio present opportunities for growth with targeted sales strategies focused on high-growth electronics and industrial sectors.

Winbond Tech Stack

Winbond uses 8 technology products and services including Canva, Power BI, UiPath, and more. Explore Winbond's tech stack below.

  • Canva
    Audio, Video, Graphics
  • Power BI
    Business Intelligence
  • UiPath
    Business Process Management
  • cdnjs
    Content Delivery Network
  • Open Graph
    Content Management System
  • Babel
    Development
  • TensorFlow
    Machine Learning
  • Hugging Face
    Machine Learning

Media & News

Winbond's Email Address Formats

Winbond uses at least 1 format(s):
Winbond Email FormatsExamplePercentage
FLast@winbond.comJDoe@winbond.com
82%
First.Last@winbond.comJohn.Doe@winbond.com
12%
FMLast@winbond.comJMDoe@winbond.com
3%
Last@winbond.comDoe@winbond.com
3%

Frequently Asked Questions

Where is Winbond's headquarters located?

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Winbond's main headquarters is located at Daya, Taichung City 428 Taiwan. The company has employees across 4 continents, including North AmericaAsiaEurope.

What is Winbond's phone number?

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You can contact Winbond's main corporate office by phone at . For more prospecting data, LeadIQ has access to up-to-date and accurate contact information within our platform. Find, capture, and sync contact data to your CRM and sales tools in one click.

What is Winbond's stock symbol?

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Winbond is a publicly traded company; the company's stock symbol is 2344.TW.

What is Winbond's official website and social media links?

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Winbond's official website is winbond.com and has social profiles on LinkedIn.

How much revenue does Winbond generate?

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As of March 2026, Winbond's annual revenue is estimated to be $1.7B.

What is Winbond's SIC code NAICS code?

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Winbond's SIC code is 3429 - Hardware, Not Elsewhere Classified NAICS code is 3344 - Semiconductor and Other Electronic Component Manufacturing.

How many employees does Winbond have currently?

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As of March 2026, Winbond has approximately 1.5K employees across 4 continents, including North AmericaAsiaEurope. Key team members include Chief Information Officer: M. P. T.Vice President Of Marketing: J. H.Vice President Sales Americas: W. H.. Explore Winbond's employee directory with LeadIQ.

What industry does Winbond belong to?

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Winbond operates in the Semiconductor Manufacturing industry.

What technology does Winbond use?

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Winbond's tech stack includes CanvaPower BIUiPathcdnjsOpen GraphBabelTensorFlowHugging Face.

What is Winbond's email format?

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Winbond's email format typically follows the pattern of FLast@winbond.com. Find more Winbond email formats with LeadIQ.

When was Winbond founded?

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Winbond was founded in 1987.

Winbond

Semiconductor ManufacturingTaichung City, Taiwan1001-5000 Employees

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. 

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. 

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Section iconCompany Overview

Headquarters
Daya, Taichung City 428 Taiwan
Phone number
SIC Code
3429 - Hardware, Not Elsewhere Classified
Stock Symbol
2344.TW
NAICS Code
3344 - Semiconductor and Other Electronic Component Manufacturing
Founded
1987
Employees
1001-5000

Section iconFunding & Financials

  • $100M$250M

    Winbond's revenue is estimated to be in the range of $100M$250M

Section iconFunding & Financials

  • $100M$250M

    Winbond's revenue is estimated to be in the range of $100M$250M

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