AmTECH Microelectronics

Semiconductor ManufacturingUnited States51-200 Employees

AmTECH Microelectronics is a custom microelectronics assembly and packaging services company - OSAT; based in Morgan Hill, CA. Since 1993, AmTECH has specialized in process development, design for manufacturing (DFM), and on-shore prototype to production. AmTECH’s assembly processes include: flip chip bonding, die bonding, fine and heavy wire bonding, vacuum reflow, silver sintering, dispense and encapsulation, and SMT assembly. Our facility features a fully equipped cleanroom with state-of-the-art automated equipment. AmTECH is proud to be ISO 9001:2015 and ISO 13485:2016 certified, ITAR registered, in compliance with IPC-A-610, and follows MIL-STD-883 workmanship standards.

Complete Automation for Microelectronics Assembly (Cleanroom):

•	Die Attach, Flip-Chip, SIP, SOP, MCM.
•	Gold and Aluminum Wire Bonding (small & large diameter)
•	Glob Top, Dam & Fill, Underfill, UV, Lid Attach.
•       EIC & PIC Technologies
•       MEMS & Photonics
•       Design For Manufacturing & Design For Test
•       High Complexity SMT Assembly
•	PCB, Rigid-Flex, Flex, Interposer, and Ceramic substrates
•      Heterogeneous Integration

To learn more about our company and services please visit our website: http://amtechmicro.com/

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