Target compact CSI EoPlex specializes in CSI™ 3D-printed packaging that enables ultra-thin, compact packages under 250µm, high lead counts, and multi-row DAPs, which aligns well with customers seeking smaller, cost-efficient packages for mobile, wearable, and IoT devices.

Expand QFN viability The CSI™ process allows QFN-level performance with packaging that may substitute for more expensive QFP and BGA options, presenting an opportunity to convert customers using traditional larger packages to lighter, more economical solutions.

High lead density With the capability of up to 500 leads and optimized configurations for low and high lead applications, EoPlex can target customers needing dense interconnects for complex SiP assemblies and multi-die integration.

SiP and integration Potential use in System-in-Package (SiP) scenarios opens sales doors with companies pursuing compact, integrated modules, enabling cross-sell into customers demanding integrated semiconductor solutions with reduced footprint.

Growth-aligned partnerships Operating in the hard-to-serve small team segment with revenue in the low millions, EoPlex can be a strategic partner for larger electronics manufacturers seeking agility, advanced packaging capabilities, and rapid prototyping to accelerate time-to-market.