Innovative Packaging Development Nepes is actively developing advanced Package on Package technology with mass production targeted for the second half of 2025, indicating an opportunity to collaborate on cutting-edge semiconductor packaging solutions.

Global Expansion Strategy The company's recent facility expansions in Singapore, China, Japan, and Russia demonstrate a strategic focus on strengthening regional manufacturing capabilities, opening doors for partnership and supply chain integration in diverse markets.

Product Portfolio Diversification Nepes offers a broad range of IC back-end services including wafer bumping, wafer level packages, SiP, and FOPLP, providing multiple entry points for tailored solutions up and downstream in semiconductor assembly.

Sustainability and Regional Focus With a mission emphasizing regional development and multiple manufacturing sites across Asia and Russia, Nepes presents opportunities for localized supplier relationships and sustainability-driven collaborations.

Market Growth Potential Nepes’s focus on developing new packaging technologies and expanding global manufacturing footprint suggests a strong growth trajectory within the rapidly evolving semiconductor industry, making it a compelling partner for innovative supply chain solutions.