Global Expansion Opportunities Nepes has a strategic global footprint with manufacturing facilities and sales offices across South Korea, China, the Philippines, Singapore, Russia, and Taiwan. This extensive international presence indicates opportunities to collaborate on regional projects and expand sales across diverse markets.

Innovative Technology Development Nepes is actively developing advanced packaging technologies like Package on Package (PoP) which is expected to reach mass production by late 2025. Partnering with Nepes for cutting-edge technology solutions positions companies at the forefront of semiconductor innovation.

Mid-Sized Market Focus With revenue estimated between $50 million and $100 million and a dedicated workforce of around 200 employees, Nepes offers personalized and flexible service options, appealing to fabless companies and IDM customers seeking agile back-end manufacturing partnerships.

Growth in Semiconductor Back-End Services Nepes’s core services include wafer bumping, IC packaging, and testing for 8-inch and 12-inch wafers, aligned with increasing demand for advanced semiconductor packaging. This presents an opportunity to introduce complementary testing and supply chain management solutions.

Potential for Strategic Alliances Given Nepes’s plans to expand into LED manufacturing and establish numerous high-tech plants, there are prospects for joint ventures, technology licensing, and supply chain integrations in emerging markets to support their growth initiatives.