Market Leadership STATS ChipPAC is a globally recognized leader in semiconductor backend manufacturing and advanced packaging technologies, serving diverse sectors such as mobile, automotive, and industrial, which presents opportunities to supply innovative materials, equipment, or software solutions tailored to high-tech manufacturing processes.

Technological Innovation The company's focus on advanced wafer-level packaging, 2.5D/3D integration, and System-in-Package solutions indicates a demand for cutting-edge manufacturing equipment and engineering services that can support complex, high-performance semiconductor packaging, offering potential sales of specialized tools and R&D collaborations.

Recent Recognition Winning the 'Excellent Supplier Award of 2022' and ranking among the top 10 semiconductor equipment manufacturers signal a strong reputation and consistent performance, creating opportunities for partnerships in supply chain enhancements, quality optimization, and technology upgrades.

Global Footprint With manufacturing and R&D centers in Singapore and Korea and operations worldwide, there is a substantial scope for providing localized services, logistical solutions, or regional supply chain integration to optimize production efficiency and delivery.

Financial Scope Generating between 250 million and 500 million dollars in revenue with over 10,000 employees, STATS ChipPAC offers a sizeable market for high-value equipment, materials, and service solutions aimed at expanding capacity, enhancing yield, or upgrading technological capabilities in high-volume manufacturing.