Technology Applications, Inc logo

Technology Applications, Inc Employee Directory

Defense and Space ManufacturingColorado, United States2-10 Employees

Technology Applications, Inc. is a Boulder, Colorado-based manufacturer that specializes in heat-transfer straps for aerospace, defense, and electronics applications. The company produces copper straps using oxygen-free high-conductivity copper and a proprietary graphite material marketed as GraFlex, aiming to meet demanding requirements while keeping costs accessible for universities, national laboratories, and commercial electronics projects. Copper straps are offered in standard, off-the-shelf configurations, while the graphite options emphasize low mass and enhanced heat transfer, with additional damping properties for vibration.

All straps are assembled in-house at TAI's facility, with a team approach that includes design, thermal engineering, program management, production, assembly and testing, and quality assurance to support customer programs. The company supports orders ranging from a few units to large quantities and can refer customers to reputable external suppliers if their requirements cannot be met in-house. In early 2025, TAI expanded its line with new X4 series straps and introduced the P40 series, reflecting ongoing product development.

Find Technology Applications, Inc employees' phone numbers or email addresses

Technology Applications, Inc Global Highlights

Location
Employees

North America
10

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  • United States Of America
    10

Technology Applications, Inc's Leadership

  • Stylized image of a person
    B. M.
    President
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  • Stylized image of a person
    B. S.
    Owner And President
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  • Stylized image of a person
    J. T. L.
    Director Of Business Development
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  • Stylized image of a person
    G. F.
    Business Manager
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  • Stylized image of a person
    R. R.
    Solidworks Design Engineer
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  • Stylized image of a person
    J. M.
    Teacher
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Technology Applications, Inc Employee Metrics

100%
50%
0%
2026
2025
  • Business
  • Business Development
  • Accounting
  • Administrative
  • Analytics
  • Other

Contact profiles from Technology Applications, Inc

Name
Title
Contact Info
Location
Last Update
  • Stylized image of a person
    B. S.
    Owner And President
    Phone icon
    United StatesColorado
    Dec 10, 2025
  • Stylized image of a person
    B. M.
    President
    Phone icon
    United StatesColorado
    Dec 10, 2025
  • Stylized image of a person
    J. T. L.
    Director Of Business Development
    Phone icon
    United StatesColorado
    Mar 24, 2026
  • Stylized image of a person
    G. F.
    Business Manager
    Phone icon
    United StatesColorado
    Dec 10, 2025
  • Stylized image of a person
    R. R.
    Solidworks Design Engineer
    Phone icon
    United StatesColorado
    Dec 10, 2025
  • Stylized image of a person
    J. M.
    Teacher
    Phone icon
    United StatesTexas
    Sep 10, 2024

Frequently Asked Questions

What is Technology Applications, Inc known for?

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Technology Applications, Inc was founded in 1994 operates in the Defense and Space Manufacturing industry; you can contact the main corporate office by phone at . Explore Technology Applications, Inc's company overview page for more information.

What is Technology Applications, Inc's most common email format?

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Technology Applications, Inc employees' email format typically follows the pattern of . Trying to find reliable and up-to-date employee contact data? Find more Technology Applications, Inc email formats with LeadIQ.

How many employees does Technology Applications, Inc have currently?

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Technology Applications, Inc has approximately 8 employees as of July 2026. These team members are located across 1 continents, including North America.

Who are Technology Applications, Inc's key employees and leadership?

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As of July 2026, Technology Applications, Inc's key employees include:

  • President: B. M.
  • Owner And President: B. S.
  • Director Of Business Development: J. T. L.
  • Business Manager: G. F.
  • Solidworks Design Engineer: R. R.

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