Insights

Strategic Partnerships Tessolve’s active collaboration with Intel Foundry and its expanding global lab network create cross-selling opportunities for embedded test services, EMIB package support, and multi-die interconnect solutions across high-growth markets such as AI, automotive, and 5G infrastructure.

R&D Investment Ongoing investments in 5G, mmWave, silicon photonics, HBM/HPI, and system-level tests position Tessolve to offer advanced pre-silicon and post-silicon verification services to Tier 1 customers pursuing cutting-edge silicon designs.

End-to-End Capability With turnkey ASIC design-to-packaged-parts and ODM style embedded engineering, Tessolve can upsell comprehensive hardware/software integration, enabling customers to shorten time-to-market in avionics, automotive, industrial, and medical segments.

Global Lab Network Global presence in strategic tech regions plus multiple test labs enables scalable engagement for customers seeking distributed validation, compliance testing, and rapid prototyping across geographies.

Market Validation Recognition such as the Intel EPIC Supplier Award and executive leadership appointments signal credibility to enterprise buyers, easing procurement cycles and opening doors for larger, multi-year design and testing contracts.

Tessolve Tech Stack

Tessolve uses 8 technology products and services including SAP, Intel, Microsoft Azure SQL Database, and more. Explore Tessolve's tech stack below.

  • SAP
    Customer Relationship Management
  • Intel
    Customer Relationship Management
  • Microsoft Azure SQL Database
    Database
  • Azure DevOps
    Devops
  • tcpdump
    Network Management
  • Yoast SEO
    Search Engines
  • Piwik PRO Core
    Web Analytics
  • Apache
    Web Servers

Media & News

Tessolve's Email Address Formats

Tessolve uses at least 1 format(s):
Tessolve Email FormatsExamplePercentage
First.Last@tessolve.comJohn.Doe@tessolve.com
92%
Last@tessolve.comDoe@tessolve.com
3%
First@tessolve.comJohn@tessolve.com
3%
Last.First@tessolve.comDoe.John@tessolve.com
2%

Frequently Asked Questions

What is Tessolve's phone number?

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You can contact Tessolve's main corporate office by phone at . For more prospecting data, LeadIQ has access to up-to-date and accurate contact information within our platform. Find, capture, and sync contact data to your CRM and sales tools in one click.

What is Tessolve's official website and social media links?

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Tessolve's official website is tessolve.com and has social profiles on LinkedInCrunchbase.

How much revenue does Tessolve generate?

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As of July 2026, Tessolve's annual revenue is estimated to be $25M - $50M.

What is Tessolve's SIC code NAICS code?

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Tessolve's SIC code is 8711 - Engineering Services NAICS code is 3344 - Semiconductor and Other Electronic Component Manufacturing.

How many employees does Tessolve have currently?

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As of July 2026, Tessolve has approximately 3K employees across 3 continents, including AsiaNorth AmericaEurope. Key team members include Chief Financial Officer: R. J.Chief Human Resources Officer: R. K.Vice President - Embedded Systems: P. P.. Explore Tessolve's employee directory with LeadIQ.

What industry does Tessolve belong to?

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Tessolve operates in the Semiconductor Manufacturing industry.

What technology does Tessolve use?

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Tessolve's tech stack includes SAPIntelMicrosoft Azure SQL DatabaseAzure DevOpstcpdumpYoast SEOPiwik PRO CoreApache.

What is Tessolve's email format?

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Tessolve's email format typically follows the pattern of First.Last@tessolve.com. Find more Tessolve email formats with LeadIQ.

How much funding has Tessolve raised to date?

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As of July 2026, Tessolve has raised $190M in funding. The last funding round occurred on Sep 01, 2025 for $150M.

When was Tessolve founded?

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Tessolve was founded in 2004.
Tessolve logo

Tessolve

Semiconductor ManufacturingKarnataka, India1001-5000 Employees

Based in Bangalore, Tessolve is a semiconductor engineering services provider offering turnkey ASIC solutions from design to packaged parts, drawing on both pre-silicon and post-silicon expertise. It operates with a global footprint and a large engineering workforce, delivering integrated hardware and software capabilities supported by silicon and system testing labs. The approach emphasizes catching design flaws early to reduce costly rework, and the company maintains active R&D programs in areas including 5G, mmWave, silicon photonics, HSIO, HBM/HPI, and system-level testing.
Its client base includes leading Tier 1 semiconductor companies, startups, and government entities, spanning avionics, automotive, industrial, and medical segments under an ODM model for embedded design. In April 2026, Tessolve announced the appointment of Ravi Kumar Chirugudu as President and Chief Operating Officer, signaling leadership expansion as it continues to grow its global engineering capabilities.

Section iconCompany Overview

Phone number
SIC Code
8711 - Engineering Services
NAICS Code
3344 - Semiconductor and Other Electronic Component Manufacturing
Founded
2004
Employees
1001-5000

Section iconFunding & Financials

  • $190M

    Tessolve has raised a total of $190M of funding over 3 rounds. Their latest funding round was raised on Sep 01, 2025 in the amount of $150Mas a private_equity.

  • $25M - $50M

    Tessolve's revenue is estimated to be in the range of $25M - $50M

Section iconFunding & Financials

  • $190M

    Tessolve has raised a total of $190M of funding over 3 rounds. Their latest funding round was raised on Sep 01, 2025 in the amount of $150Mas a private_equity.

  • $25M - $50M

    Tessolve's revenue is estimated to be in the range of $25M - $50M

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