Insights

Specialized Services Grinding and Dicing Services Inc offers highly specialized wafer dicing and grinding solutions for complex applications across semiconductor, MEMS, and life sciences markets, making them a valuable partner for clients with demanding technical requirements.

Market Experience With over 20 years of experience and ISO 9001:2008 accreditation, GDSI demonstrates a proven track record of supporting both military and commercial projects, indicating reliability and expertise in critical manufacturing processes.

Growth Potential Operating with a small team and generating up to $1 million in revenue, GDSI presents opportunities for close partnerships and customized services for niche clients in high-value segments.

Technology Adoption Utilization of advanced processing methods such as Stealth Laser Dicing and strict cleanliness controls positions GDSI as a technically capable supplier, which can be leveraged to target high-end clients requiring precision and quality.

Digital Presence The company’s use of digital tools like Google Ads, WordPress, and Google Tag Manager suggests an active online marketing strategy, offering avenues for outreach and lead generation in targeted industries.

Grinding and Dicing Services Inc Tech Stack

Grinding and Dicing Services Inc uses 8 technology products and services including Google Ads Conversion Tracking, BootstrapCDN, WordPress, and more. Explore Grinding and Dicing Services Inc's tech stack below.

Google Ads Conversion Tracking

Analytics

BootstrapCDN

Content Delivery Network

WordPress

Content Management System

Floating UI

Javascript Libraries

reCAPTCHA

Security

Google Tag Manager

Tag Management

GoDaddy

Web Hosting

Apache

Web Servers

Grinding and Dicing Services Inc Email Formats	Example	Percentage
FLast@wafergrind.com	JDoe@wafergrind.com	75%
Last@wafergrind.com	Doe@wafergrind.com	25%
FLast@dieprepservices.com	JDoe@dieprepservices.com	100%

Grinding and Dicing Services Inc Email Formats

Example

Percentage

FLast@wafergrind.com

JDoe@wafergrind.com

75%

Last@wafergrind.com

Doe@wafergrind.com

25%

FLast@dieprepservices.com

JDoe@dieprepservices.com

100%

Frequently Asked Questions

Where is Grinding and Dicing Services Inc's headquarters located?

Grinding and Dicing Services Inc's main headquarters is located at 925 Berryessa Road San Jose, California United States. The company has employees across 1 continents, including North America.

What is Grinding and Dicing Services Inc's phone number?

You can contact Grinding and Dicing Services Inc's main corporate office by phone at

+1-408-451-****

. For more prospecting data, LeadIQ has access to up-to-date and accurate contact information within our platform. Find, capture, and sync contact data to your CRM and sales tools in one click.

What is Grinding and Dicing Services Inc's official website and social media links?

Grinding and Dicing Services Inc's official website is dieprepservices.com and has social profiles on LinkedIn.

What is Grinding and Dicing Services Inc's NAICS code?

Grinding and Dicing Services Inc's NAICS code is 3344 - Semiconductor and Other Electronic Component Manufacturing.

How many employees does Grinding and Dicing Services Inc have currently?

As of March 2026, Grinding and Dicing Services Inc has approximately 5 employees across 1 continents, including North America. Key team members include Senior Process Engineer: R. S.Senior Sales Engineer: R. B.. Explore Grinding and Dicing Services Inc's employee directory with LeadIQ.

What industry does Grinding and Dicing Services Inc belong to?

Grinding and Dicing Services Inc operates in the Semiconductor Manufacturing industry.

What technology does Grinding and Dicing Services Inc use?

Grinding and Dicing Services Inc's tech stack includes Google Ads Conversion TrackingBootstrapCDNWordPressFloating UIreCAPTCHAGoogle Tag ManagerGoDaddyApache.

What is Grinding and Dicing Services Inc's email format?

Grinding and Dicing Services Inc's email format typically follows the pattern of FLast@wafergrind.com. Find more Grinding and Dicing Services Inc email formats with LeadIQ.

When was Grinding and Dicing Services Inc founded?

Grinding and Dicing Services Inc was founded in 1992.

Grinding and Dicing Services Inc

Q: What technology does Grinding and Dicing Services Inc use?

Grinding and Dicing Services Inc's tech stack includes GoDaddy, Microsoft 365, Google Ads Conversion Tracking, RSS, Google Analytics.

Semiconductor ManufacturingCalifornia, United States2-10 Employees

The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications.  Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects.

Specialties:
Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding

Insights

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