Grinding and Dicing Services Inc Employee Directory

Semiconductor ManufacturingCalifornia, United States2-10 Employees

The company operates in the semiconductor manufacturing sector, offering wafer dicing, grinding, thinning, polishing, inspection, and related processing services. It is based at 925 Berryessa Road in San Jose, California, United States, and employs a small team of 2 to 10 people. Serving diverse market segments including semiconductor, MEMS, and life sciences, it provides continuity of support from NPI to commercial-scale manufacturing for both commercial and military applications. The organization maintains robust static and cleanliness controls and is ISO 9001:2008 certified. Its capabilities include stealth laser dicing, wafer dicing, grinding, thinning, polishing, inspection, wafer saw, 300 mm processing, die bonding, and work with materials such as SiC, glass, and silicon; it has supported fab and fabless customers for more than 20 years.

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