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Browse Grinding and Dicing Services Inc's employee directory (about 5 employees) and reveal verified emails free.
Grinding and Dicing Services Inc's most common email format is FLast@wafergrind.com (ex. JDoe@wafergrind.com), used for 75% of wafergrind.com addresses. Grinding and Dicing Services Inc uses 3 email patterns across 2 domains: wafergrind.com and dieprepservices.com. Percentages are the share of addresses within each domain.
| Format | Example | Share of wafergrind.com |
|---|---|---|
| FLast@wafergrind.comMost common | JDoe@wafergrind.com | |
| Last@wafergrind.com | Doe@wafergrind.com |
| Format | Example | Share of dieprepservices.com |
|---|---|---|
| FLast@dieprepservices.comMost common | JDoe@dieprepservices.com |
Browse Grinding and Dicing Services Inc's employee directory (about 5 employees) and reveal verified emails free.
Semiconductor ManufacturingCalifornia, United States2-10 Employees
The company operates in the semiconductor manufacturing sector, offering wafer dicing, grinding, thinning, polishing, inspection, and related processing services. It is based at 925 Berryessa Road in San Jose, California, United States, and employs a small team of 2 to 10 people. Serving diverse market segments including semiconductor, MEMS, and life sciences, it provides continuity of support from NPI to commercial-scale manufacturing for both commercial and military applications. The organization maintains robust static and cleanliness controls and is ISO 9001:2008 certified. Its capabilities include stealth laser dicing, wafer dicing, grinding, thinning, polishing, inspection, wafer saw, 300 mm processing, die bonding, and work with materials such as SiC, glass, and silicon; it has supported fab and fabless customers for more than 20 years.
Most common format
FLast@wafergrind.com
Example: JDoe@wafergrind.com
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